KOEN

Global Vision

Advanced
Power Solutions

Delivering high-reliability power semiconductor
packaging & module solutions to global markets.

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SiC Packaging
GaN Packaging
Power Module
Reliability Test
About NexGen Semicon

Shaping the future of power conversion
through innovative packaging

NexGen Semicon is a specialized startup in the packaging and power module manufacturing of next-generation Wide Bandgap (SiC/GaN) power semiconductors, delivering high-reliability solutions for EVs, renewable energy, and industrial automation.

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SiC/GaNWBG Materials
200℃+High-Temp Design
EV·IndKey Applications
Core Business

Total Power Solution Provider

From design to packaging, assembly and testing — a total power-semiconductor solution.

Power Semiconductor Packaging

High-thermal-resistance structures for 175–200℃+ operation

Power Module Design & Mfg.

Multi-chip modules for EV inverters, AMB/DBC bonding

Join us in shaping the future

We welcome experts to grow the power semiconductor (SiC/GaN) business with us.

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