NexGen Semicon is seeking global talent to join us in shaping the future of the power semiconductor (SiC/GaN) industry.
1. Key Responsibilities
- Power semiconductor packaging design & line process optimization
- Power module design and manufacturing
- Yield improvement & quality reliability establishment
2. Requirements
15+ years of experience in power semiconductor packaging, module design, or manufacturing (Retirees are highly welcome)
3. Employment Terms & Benefits for Foreign Engineers
- Contract Term: 1-year residential contract (renewable upon mutual agreement)
- Compensation: Top industry rates (negotiable based on experience)
- Benefits: Premium residence provided, dedicated interpretation/translation support, and periodic round-trip flight tickets to home country
4. Inquiries & Applications
Please reach out via LinkedIn message or contact us at [email protected].
[email protected]