KOEN

Core Business

Total Power Solution Provider

Business

A total solution for power-semiconductor
packaging & power modules

SiC/GaN Packaging

Power Semiconductor (SiC/GaN) Packaging

Development and manufacturing of high-heat-resistant thermal dissipation structures and packaging technologies capable of withstanding high-temperature operating environments (175°C to 200°C and above).

Power Module

Power Module Design & Manufacturing

  • Design and manufacturing of high-reliability Multi-Chip Modules for Electric Vehicles (EVs), Energy Storage Systems (ESS), and industrial inverters.
  • High-end module packaging utilizing advanced substrate bonding (AMB, DBC) and innovative base materials.